Gemalto M2M GmbH ELS51-V 사용자 설명서

®

1.1 Key Features at a Glance



ELS31-V_ELS51-V_HIO_v00.502

2015-12-07

Confidential / Preliminary

Page 3 of 35

Module interface

Surface mount device with solderable connection pads (SMT application 
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and allows the use of an optional module mounting socket.

For more information on how to integrate SMT modules see also 

application note comprises chapters on module mounting and application 
layout issues as well as on SMT application development equipment.

USB

USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)
compliant

2 serial interfaces 

ASC0:
•

8-wire modem interface with status and control lines, unbalanced, asyn-
chronous

•

Default baud rate: 115,200 baud

•

Adjustable baud rates: 1,200 to 921,600, no autobauding support

•

Supports RTS0/CTS0 hardware flow control. 

•

indication of incoming data/SMS on RING0 (can be used to wake up
host from power down modes)

ELS51-V only:
ASC1 (shared with GPIO lines):
•

4-wire, unbalanced asynchronous interface

•

Default baud rate: 115,200 baud

•

Adjustable baud rates: 1,200bps to 921,600bps

•

Supports RTS1/CTS1 hardware flow control

UICC interface

Supported SIM/USIM cards: 3V, 1.8V

Embedded UICC

Module is prepared for an embedded UICC

GPIO interface

20 pads of the application interface programmable as GPIO pads (17) or 
GPO pads (3):
GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and 
SPI signal lines
Programming is done via AT commands

I

2

C interface

Supports I

2

C serial interface

SPI interface

Supports SPI interface

SDIO

ELS51-V only:
4 wire interface.

HSIC

ELS51-V only:
High Speed Interchip Communication interface. 

ADC

Analog-to-Digital Converter with one unbalanced analog input.

Digitial audio interface

Hardware prepared for future use.

Antenna interface pads

50

 LTE main antenna, 50LTE diversity antenna