F. Robotics Acquisitions Ltd. RB-3 사용자 설명서
Page 2 of 5 ESB9000
– Main Board RX V01
Production Process
1. SMT and Reflow (C.S)
2. Wave soldering of T.H components (C.S)
#
PN
Ref Designator
Remarks
1
BUZ9000G
BZ800
See the mark at the board insertion
2
CON0214G
J100
See the mark at the board insertion
4
CON0219G
J300,J301
See the mark at the board insertion
5
CON0213G
J400
See the mark at the board insertion
6
CON0220G
J500,J700
See the mark at the board insertion
7
CON0002G
J800
See the mark at the board insertion
8
CON0216G
J801
See the mark at the board insertion
3. Visual inspection for shortages and left over Tin.
4. Marking and Labeling
Attach S/n & P/n label on C.S.
(watch below image)
Label size: 16x9.4 mm max
Label should include:
1. Item P/n
2. Board S/n:
2. Board S/n:
• ‘S’ = 1
st
Supplier Digit
• ‘WW’ = Week
• ‘YY’ = Year
• +8 digits for supplier use (Total 13 Digits)
• ‘YY’ = Year
• +8 digits for supplier use (Total 13 Digits)
3. Barcode
5. ICT Test
6. Cleaning
ESB9000
SWWYYxxxxxxxx