Texas Instruments AM18x eXperimenter's Kit TMDSEXP1808L TMDSEXP1808L 데이터 시트
제품 코드
TMDSEXP1808L
SPRS653E – FEBRUARY 2010 – REVISED MARCH 2014
8.2
Thermal Data for ZWT Package
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical
package.
package.
Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
°C/W
(1)
AIR FLOW (m/s)
(2)
1
R
Θ
JC
Junction-to-case
7.3
N/A
2
R
Θ
JB
Junction-to-board
12.4
N /A
3
R
Θ
JA
Junction-to-free air
23.7
0.00
4
21.0
0.50
5
20.1
1.00
R
Θ
JMA
Junction-to-moving air
6
19.3
2.00
7
18.4
4.00
8
0.2
0.00
9
0.3
0.50
10
Psi
JT
Junction-to-package top
0.3
1.00
11
0.4
2.00
12
0.5
4.00
13
12.3
0.00
14
12.2
0.50
15
Psi
JB
Junction-to-board
12.1
1.00
16
12.0
2.00
17
11.9
4.00
(1)
These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2)
m/s = meters per second
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Mechanical Packaging and Orderable Information
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