Texas Instruments DM6467 Digital Video Evaluation Module TMDXEVM6467T TMDXEVM6467T 데이터 시트
제품 코드
TMDXEVM6467T
SPRS605C – JULY 2009 – REVISED JUNE 2012
8
Mechanical Packaging and Orderable Information
The following table(s) show the thermal resistance characteristics for the PBGA–CUT mechanical
package.
package.
8.1
Thermal Data for CUT
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [CUT]
NO.
°C/W
(1)
AIR FLOW (m/s)
(2)
1
R
Θ
JC
Junction-to-case
1.5
N/A
2
R
Θ
JB
Junction-to-board
9.9
N/A
3
R
Θ
JA
Junction-to-free air
19.2
0.00
4
14.8
0.50
5
13.8
1.00
R
Θ
JMA
Junction-to-moving air
6
12.7
2.00
7
11.9
3.00
8
0.3
0.00
9
0.4
0.50
10
Psi
JT
Junction-to-package top
0.4
1.00
11
0.4
2.00
12
0.5
3.00
13
9.0
0.00
14
8.0
0.50
15
Psi
JB
Junction-to-board
7.7
1.00
16
7.3
2.00
17
7.0
3.00
(1)
These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages.
(2)
m/s = meters per second
8.2
Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
designated device(s). This data is subject to change without notice and without revision of this document.
348
Mechanical Packaging and Orderable Information
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s):