Texas Instruments DM6467 Digital Video Evaluation Module TMDXEVM6467T TMDXEVM6467T 데이터 시트
제품 코드
TMDXEVM6467T
PACKAGE OPTION ADDENDUM
www.ti.com
8-Feb-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TMS320DM6467TCUT1
ACTIVE
FCBGA
CUT
529
84
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320
DM6467TCUT1
DM6467TCUT1
TMS320DM6467TCUT9
ACTIVE
FCBGA
CUT
529
84
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320
DM6467TCUT9
DM6467TCUT9
TMS320DM6467TCUTD1
ACTIVE
FCBGA
CUT
529
84
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 85
TMS320
DM6467TCUTD1
DM6467TCUTD1
TMS320DM6467TCUTL1
ACTIVE
FCBGA
CUT
529
84
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
TMS320
DM6467TCUTL1
DM6467TCUTL1
TMS320DM6467TZUT1
OBSOLETE
FCBGA
ZUT
529
TBD
Call TI
Call TI
0 to 85
TMS320
DM6467TZUT1
DM6467TZUT1
TMS320DM6467TZUT9
LIFEBUY
FCBGA
ZUT
529
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320
DM6467TZUT9
DM6467TZUT9
TMS320DM6467TZUTD1
LIFEBUY
FCBGA
ZUT
529
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-245C-72HR
-40 to 85
TMS320
DM6467TZUTD1
DM6467TZUTD1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.