Texas Instruments DM6467 Digital Video Evaluation Module TMDXEVM6467T TMDXEVM6467T 데이터 시트
제품 코드
TMDXEVM6467T
PREFIX
TMS
320
DM6467T
CUT
TMX = Experimental device
TMS = Qualified device
TMS = Qualified device
DEVICE FAMILY
32 or 320 = TMS320™ DSP family
PACKAGE TYPE
(A)
CUT = 529-pin plastic BGA, with Pb-Free die bump and solder ball
C64x+™ DSP:
DM6467T
DEVICE
DEVICE SPEED RANGE
1 = 1-GHz DSP, 500-MHz ARM9, 150-MHz VPIF, 400-MHz DDR2
TEMPERATURE RANGE
( )
( )
SILICON REVISION
Blank = Revision 3.0
Blank = 0° C to 85° C, Commercial Temperature
D = -40° C to 85° C, Industrial Temperature
TMX
Blank = Revision 3.0
TMS
1
SPRS605C – JULY 2009 – REVISED JUNE 2012
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, CUT), the temperature range (for example, "Blank" is the commercial
temperature range), and the device speed range in megahertz or gigahertz (for example, "1" is the default
[1-GHz DSP, 500-MHz ARM9, 150-MHz VPIF, 400-MHz DDR2]).
package type (for example, CUT), the temperature range (for example, "Blank" is the commercial
temperature range), and the device speed range in megahertz or gigahertz (for example, "1" is the default
[1-GHz DSP, 500-MHz ARM9, 150-MHz VPIF, 400-MHz DDR2]).
provides a legend for reading the complete device name for any TMS320DM6467T DMSoC
platform member.
A.
BGA = Ball Grid Array
B.
For actual device part number (P/Ns) and ordering information, see the TI website (
Figure 3-8. Device Nomenclature
(B)
Copyright © 2009–2012, Texas Instruments Incorporated
Device Overview
79
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