Texas Instruments IC MCU 16B MSP430F167IPM LQFP-64 TID MSP430F167IPM 데이터 시트
제품 코드
MSP430F167IPM
MSP430F15x, MSP430F16x, MSP430F161x
MIXED SIGNAL MICROCONTROLLER
SLAS368G − OCTOBER 2002 − REVISED MARCH 2011
25
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Voltage applied at V
CC
to V
SS
−0.3 V to 4.1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note)
−0.3 V to V
CC
+ 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal .
±
2 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
: Unprogrammed device
−55
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Programmed device
−55
°
C to 85
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TDI/TCLK pin when blowing the JTAG fuse.
recommended operating conditions
MIN
NOM
MAX
UNIT
Supply voltage during program execution,
V
V
CC
(AV
CC
= DV
CC
= V
CC
)
MSP430F15x/16x/161x
1.8
3.6
V
Supply voltage during flash memory programming, V
CC
(AV
CC
= DV
CC
= V
CC
)
MSP430F15x/16x/161x
2.7
3.6
V
Supply voltage during program execution, SVS enabled
(see Note 1), V
(see Note 1), V
CC
(AV
CC
= DV
CC
= V
CC
)
MSP430F15x/16x/161x
2
3.6
V
Supply voltage, V
SS
(AV
SS
= DV
SS
= V
SS
)
0
0
V
Operating free-air temperature range, T
A
MSP430F15x/16x/161x
−40
85
°
C
LFXT1
t l f
f
LF selected, XTS=0
Watch crystal
32.768
kHz
LFXT1 crystal frequency, f
(LFXT1)
(see Notes 2 and 3)
XT1 selected, XTS=1
Ceramic resonator
450
8000
kHz
(see Notes 2 and 3)
XT1 selected, XTS=1
Crystal
1000
8000
kHz
XT2 crystal frequency f
Ceramic resonator
450
8000
kHz
XT2 crystal frequency, f
(XT2)
Crystal
1000
8000
kHz
Processor frequency (signal MCLK) f
V
CC
= 1.8 V
DC
4.15
MHz
Processor frequency (signal MCLK), f
(System)
V
CC
= 3.6 V
DC
8
MHz
NOTES:
1. The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply
voltage. POR is going inactive when the V
CC
is raised above the minimum supply voltage plus the hysteresis of the SVS circuitry.
2. In LF mode, the LFXT1 oscillator requires a watch crystal. A 5.1-M
Ω
resistor from XOUT to V
SS
is recommended when
V
CC
< 2.5 V. In XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 4.15 MHz at V
CC
≥
2.2 V. In
XT1 mode, the LFXT1 and XT2 oscillators accept a ceramic resonator or crystal up to 8 MHz at V
CC
≥
2.8 V.
3. In LF mode, the LFXT1 oscillator requires a watch crystal. In XT1 mode, LFXT1 accepts a ceramic resonator or a crystal.
f (MHz)
1.8 V
3.6 V
2.7 V 3 V
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
4.15 MHz
8.0 MHz
Supply Voltage − V
Supply voltage range,
’F15x/16x/161x,
during flash memory programming
’F15x/16x/161x,
during flash memory programming
Supply voltage range,
’F15x/16x/161x, during
program execution
’F15x/16x/161x, during
program execution
Figure 1. Frequency vs Supply Voltage, MSP430F15x/16x/161x