Intel E3-1105C AV8062701048800 데이터 시트

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Electrical Specifications
Intel
®
 Xeon
®
 and Intel
®
 Core™ Processors For Communications Infrastructure
Datasheet - Volume 1 of 2
May 2012
104
Document Number: 327405
-
001
 
Table 9-18. DDR3 Electrical Characteristics and AC Timings at 1066 MT/s, 
V
DDQ
 = 1.5 V ±0.075 V
Symbol
Parameter
Channel A
Channel B
Unit
Figure
Note
1,9
Max
Min
System Memory Latency Timings
T
CL
 – T
RCD
 
– T
RP
CAS Latency – RAS to CAS Delay – Pre-charge 
Command Period
7 – 7– 7
8– 8– 8
T
CK
Electrical Characteristics
T
SLR_D
DQ[63:0], DQS[8:0], DQS#[8:0] Input Slew Rate
6.5
2.0
V/ns
2
System Memory Clock Timings
T
CK
CK Period
1.875
ns
T
CH
CK High Time
0.8125
ns
T
CL
CK Low Time
0.8125
ns
T
SKEW
Skew Between Any System Memory Differential 
Clock Pair (CK/CKB)
100
ps
System Memory Command Signal Timings
T
CMD_CO 
RAS#, CAS#, WE#, MA[14:0], BA[2:0] Edge 
Placement Accuracy
+145
-145
ps
3,4,6
System Memory Control Signal Timings
T
CTRL_CO
CS#[1:0], CKE[1:0], ODT[1:0] Edge Placement 
Accuracy
+145
-145
ps
3,6
System Memory Data and Strobe Signal Timings
T
DVB
+T
DVA
DQ[63:0] Valid before DQS[8:0] Rising or Falling 
Edge
687.5
ps
7
T
Su+HD
DQ Input Setup plus Hold Time to DQS Rising or 
Falling Edge
200
ps
1,2,7
T
DQS_CO
DQS Edge Placement Accuracy to CK Rising Edge 
AFTER write levelling
+250
-250
ns
8
T
WPRE
DQS/DQS# Write Preamble Duration 
1.0
Tck
T
WPST
DQS/DQS# Write Postamble Duration
0.5
Tck
T
DQSS
CK Rising Edge Output Access Time, Where a Write 
Command Is Referenced, to the First DQS Rising 
Edge
C
WL
 x (T
CK
 
+ 4)
ns
5,6