Intel 2950M 사용자 매뉴얼

차례

• Mobile 3rd Generation Intel® Core™ Processor Family, Mobile Intel® Pentium® Processor Family, and Mobile Intel® Celeron® Processor Family

  1
• 1 Introduction

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  • 1.1 Processor Feature Details

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    • 1.1.1 Supported Technologies

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  • 1.2 Interfaces

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    • 1.2.1 System Memory Support

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    • 1.2.2 PCI Express*

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    • 1.2.3 Direct Media Interface (DMI)

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    • 1.2.4 Platform Environment Control Interface (PECI)

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    • 1.2.5 Processor Graphics

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    • 1.2.6 Embedded DisplayPort* (eDP*)

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    • 1.2.7 Intel® Flexible Display Interface (Intel® FDI)

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  • 1.3 Power Management Support

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    • 1.3.1 Processor Core

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    • 1.3.2 System

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    • 1.3.3 Memory Controller

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    • 1.3.4 PCI Express*

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    • 1.3.5 Direct Media Interface (DMI)

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    • 1.3.6 Processor Graphics Controller (GT)

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    • 1.3.7 Thermal Management Support

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  • 1.4 Processor Family SKU Definition

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  • 1.5 Package

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  • 1.6 Processor Compatibility

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  • 1.7 Terminology

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  • 1.8 Related Documents

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• 2 Interfaces

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  • 2.1 System Memory Interface

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    • 2.1.1 System Memory Technology Supported

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    • 2.1.2 System Memory Timing Support

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    • 2.1.3 System Memory Organization Modes

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      • 2.1.3.1 Single-Channel Mode

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      • 2.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode

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    • 2.1.4 Rules for Populating Memory Slots

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    • 2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)

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      • 2.1.5.1 Just-in-Time Command Scheduling

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      • 2.1.5.2 Command Overlap

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      • 2.1.5.3 Out-of-Order Scheduling

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    • 2.1.6 Data Scrambling

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    • 2.1.7 DRAM Clock Generation

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    • 2.1.8 DDR3 Reference Voltage Generation

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  • 2.2 PCI Express* Interface

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    • 2.2.1 PCI Express* Architecture

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      • 2.2.1.1 Transaction Layer

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      • 2.2.1.2 Data Link Layer

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      • 2.2.1.3 Physical Layer

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    • 2.2.2 PCI Express* Configuration Mechanism

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    • 2.2.3 PCI Express* Graphics

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      • 2.2.3.1 PCI Express* Lanes Connection

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  • 2.3 Direct Media Interface (DMI)

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    • 2.3.1 DMI Error Flow

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    • 2.3.2 Processor / PCH Compatibility Assumptions

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    • 2.3.3 DMI Link Down

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  • 2.4 Processor Graphics Controller (GT)

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    • 2.4.1 3D and Video Engines for Graphics Processing

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      • 2.4.1.1 3D Engine Execution Units

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      • 2.4.1.2 3D Pipeline

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      • 2.4.1.3 Video Engine

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      • 2.4.1.4 2D Engine

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    • 2.4.2 Processor Graphics Display

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      • 2.4.2.1 Display Planes

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      • 2.4.2.2 Display Pipes

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      • 2.4.2.3 Display Ports

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      • 2.4.2.4 Embedded DisplayPort* (eDP*)

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    • 2.4.3 Intel® Flexible Display Interface (Intel® FDI)

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    • 2.4.4 Multi Graphics Controllers Multi-Monitor Support

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  • 2.5 Platform Environment Control Interface (PECI)

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  • 2.6 Interface Clocking

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    • 2.6.1 Internal Clocking Requirements

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• 3 Technologies

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  • 3.1 Intel® Virtualization Technology (Intel® VT)

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    • 3.1.1 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Objectives

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    • 3.1.2 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Features

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    • 3.1.3 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Objectives

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    • 3.1.4 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features

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    • 3.1.5 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features Not Supported

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  • 3.2 Intel® Trusted Execution Technology (Intel® TXT)

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  • 3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)

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  • 3.4 Intel® Turbo Boost Technology

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    • 3.4.1 Intel®Turbo Boost Technology Frequency

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    • 3.4.2 Intel® Turbo Boost Technology Graphics Frequency

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  • 3.5 Intel® Advanced Vector Extensions (Intel® AVX)

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  • 3.6 Security and Cryptography Technologies

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    • 3.6.1 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)

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    • 3.6.2 PCLMULQDQ Instruction

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    • 3.6.3 RDRAND Instruction

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  • 3.7 Intel® 64 Architecture x2APIC

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  • 3.8 Supervisor Mode Execution Protection (SMEP)

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  • 3.9 Power Aware Interrupt Routing (PAIR)

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• 4 Power Management

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  • 4.1 Advanced Configuration and Power Interface (ACPI) States Supported

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    • 4.1.1 System States

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    • 4.1.2 Processor Core / Package Idle States

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    • 4.1.3 Integrated Memory Controller States

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    • 4.1.4 PCI Express* Link States

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    • 4.1.5 Direct Media Interface (DMI) States

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    • 4.1.6 Processor Graphics Controller States

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    • 4.1.7 Interface State Combinations

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  • 4.2 Processor Core Power Management

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    • 4.2.1 Enhanced Intel® SpeedStep® Technology

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    • 4.2.2 Low-Power Idle States

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    • 4.2.3 Requesting Low-Power Idle States

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    • 4.2.4 Core C-states

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      • 4.2.4.1 Core C0 State

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      • 4.2.4.2 Core C1 / C1E State

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      • 4.2.4.3 Core C3 State

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      • 4.2.4.4 Core C6 State

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      • 4.2.4.5 Core C7 State

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      • 4.2.4.6 C-State Auto-Demotion

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    • 4.2.5 Package C-States

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      • 4.2.5.1 Package C0

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      • 4.2.5.2 Package C1/C1E

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      • 4.2.5.3 Package C3 State

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      • 4.2.5.4 Package C6 State

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      • 4.2.5.5 Package C7 State

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      • 4.2.5.6 Dynamic L3 Cache Sizing

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  • 4.3 Integrated Memory Controller (IMC) Power Management

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    • 4.3.1 Disabling Unused System Memory Outputs

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    • 4.3.2 DRAM Power Management and Initialization

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      • 4.3.2.1 Initialization Role of CKE

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      • 4.3.2.2 Conditional Self-Refresh

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      • 4.3.2.3 Dynamic Power Down Operation

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      • 4.3.2.4 DRAM I/O Power Management

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    • 4.3.3 DDR Electrical Power Gating (EPG)

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  • 4.4 PCI Express* Power Management

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  • 4.5 DMI Power Management

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  • 4.6 Graphics Power Management

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    • 4.6.1 Intel® Rapid Memory Power Management (Intel® RMPM) (also known as CxSR)

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    • 4.6.2 Intel® Graphics Performance Modulation Technology (Intel® GPMT)

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    • 4.6.3 Graphics Render C-State

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    • 4.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT)

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    • 4.6.5 Intel® Graphics Dynamic Frequency

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    • 4.6.6 Display Power Savings Technology 6.0 (DPST)

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    • 4.6.7 Automatic Display Brightness (ADB)

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    • 4.6.8 Intel® Seamless Display Refresh Rate Switching Technology (Intel® SDRRS Technology)

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  • 4.7 Graphics Thermal Power Management

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• 5 Thermal Management

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  • 5.1 Thermal Considerations

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  • 5.2 Intel® Turbo Boost Technology Power Monitoring

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  • 5.3 Intel® Turbo Boost Technology Power Control

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    • 5.3.1 Package Power Control

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    • 5.3.2 Power Plane Control

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    • 5.3.3 Turbo Time Parameter

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  • 5.4 Configurable Thermal Design Power (cTDP) and Low Power Mode (LPM)

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    • 5.4.1 Configurable TDP (cTDP)

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    • 5.4.2 Low Power Mode

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  • 5.5 Thermal and Power Specifications

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  • 5.6 Thermal Management Features

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    • 5.6.1 Adaptive Thermal Monitor

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      • 5.6.1.1 TCC Activation Offset

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      • 5.6.1.2 Frequency / Voltage Control

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      • 5.6.1.3 Clock Modulation

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    • 5.6.2 Digital Thermal Sensor

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      • 5.6.2.1 Digital Thermal Sensor Accuracy (Taccuracy)

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      • 5.6.2.2 Fan Speed Control with Digital Thermal Sensor

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    • 5.6.3 PROCHOT# Signal

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      • 5.6.3.1 Bi-Directional PROCHOT#

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      • 5.6.3.2 Voltage Regulator Protection versus PROCHOT#

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      • 5.6.3.3 Thermal Solution Design and PROCHOT# Behavior

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      • 5.6.3.4 Low-Power States and PROCHOT# Behavior

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      • 5.6.3.5 THERMTRIP# Signal

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      • 5.6.3.6 Critical Temperature Detection

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    • 5.6.4 On-Demand Mode

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      • 5.6.4.1 MSR Based On-Demand Mode

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      • 5.6.4.2 I/O Emulation-Based On-Demand Mode

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    • 5.6.5 Memory Thermal Management

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    • 5.6.6 Platform Environment Control Interface (PECI)

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• 6 Signal Description

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  • 6.1 System Memory Interface Signals

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  • 6.2 Memory Reference and Compensation Signals

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  • 6.3 Reset and Miscellaneous Signals

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  • 6.4 PCI Express*-based Interface Signals

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  • 6.5 Embedded DisplayPort* (eDP*) Signals

    89
  • 6.6 Intel® Flexible Display (Intel® FDI) Interface Signals

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  • 6.7 Direct Media Interface (DMI) Signals

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  • 6.8 Phase Lock Loop (PLL) Signals

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  • 6.9 Test Access Points (TAP) Signals

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  • 6.10 Error and Thermal Protection Signals

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  • 6.11 Power Sequencing Signals

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  • 6.12 Processor Power Signals

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  • 6.13 Sense Signals

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  • 6.14 Ground and Non-Critical to Function (NCTF) Signals

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  • 6.15 Processor Internal Pull-Up / Pull-Down Resistors

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• 7 Electrical Specifications

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  • 7.1 Power and Ground Pins

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  • 7.2 Decoupling Guidelines

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    • 7.2.1 Voltage Rail Decoupling

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    • 7.2.2 PLL Power Supply

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  • 7.3 Voltage Identification (VID)

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  • 7.4 System Agent (SA) Vcc VID

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  • 7.5 Reserved or Unused Signals

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  • 7.6 Signal Groups

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  • 7.7 Test Access Port (TAP) Connection

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  • 7.8 Component Storage Condition Specifications (Prior to Board Attach)

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  • 7.9 DC Specifications

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    • 7.9.1 Voltage and Current Specifications

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  • 7.10 Platform Environmental Control Interface (PECI) DC Specifications

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    • 7.10.1 PECI Bus Architecture

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    • 7.10.2 PECI DC Characteristics

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    • 7.10.3 Input Device Hysteresis

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• 8 Processor Pin, Signal, and Package Information

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  • 8.1 Processor Pin Assignments

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  • 8.2 Package Mechanical Information

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• 9 DDR Data Swizzling

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