사용자 설명서차례FEATURES1APPLICATIONS1ORDERING INFORMATION2BLOCK DIAGRAM2QUICK SPECIFICATIONS5PIN DESCRIPTIONS6BMD-300 / BMD-3016BMD-3507RIGDFU PIN FUNCTIONS9BMDWARE PIN FUNCTIONS9ELECTRICAL SPECIFICATIONS10ABSOLUTE MAXIMUM RATINGS10OPERATING CONDITIONS10GENERAL PURPOSE I/O10MODULE RESET10DEBUG & PROGRAMMING11CLOCKS11FIRMWARE13FACTORY IMAGE138.1.1 Firmware Version ‘AA’138.1.2 Firmware Version ‘AB’138.1.3 Module Programming and Read-Back Protection13SOFTDEVICES148.2.1 S132148.2.2 S212148.2.3 S33215MAC ADDRESS INFO15MECHANICAL DATA16MECHANICAL DIMENSIONS169.1.1 BMD-300 Dimensions169.1.2 BMD-301 Dimensions169.1.3 BMD-350 Dimensions17RECOMMENDED PCB LAND PADS179.2.1 BMD-300/301179.2.2 BMD-35018MODULE MARKING18BMD-300 MODULE MARKING18BMD-301 MODULE MARKING19BMD-350 MODULE MARKING19RF DESIGN NOTES20RECOMMENDED RF LAYOUT & GROUND PLANE2011.1.1 BMD-3002011.1.2 BMD-3012011.1.3 BMD-35020MECHANICAL ENCLOSURE21ANTENNA PATTERNS2211.3.1 BMD-3002211.3.2 BMD-35024EVALUATION BOARDS25CUSTOM DEVELOPMENT25BLUETOOTH QUALIFICATION26REGULATORY STATEMENTS26FCC STATEMENT:26FCC IMPORTANT NOTES:30IC STATEMENT:28IC IMPORTANT NOTES:28CE REGULATORY:29JAPAN (MIC)29AUSTRALIA / NEW ZEALAND30APPROVED EXTERNAL ANTENNAS30SOLDER REFLOW TEMPERATURE-TIME PROFILE31MOISTURE SENSITIVITY LEVEL31PACKAGING AND LABELING31CARRIER TAPE DIMENSIONS3117.1.1 BMD-300 & BMD-3013117.1.2 BMD-35032REEL PACKAGING32PACKAGING LABEL33CAUTIONS33LIFE SUPPORT POLICY33DOCUMENT HISTORY34RELATED DOCUMENTS34크기: 2.4메가바이트페이지: 34Language: English매뉴얼 열기