Инструкции для Rigado Inc. 05

Содержание

• FEATURES

  1
• APPLICATIONS

  1
• ORDERING INFORMATION

  2
• BLOCK DIAGRAM

  2
• QUICK SPECIFICATIONS

  5
• PIN DESCRIPTIONS

  6
• BMD-300 / BMD-301

  6
• BMD-350

  7
• RIGDFU PIN FUNCTIONS

  9
• BMDWARE PIN FUNCTIONS

  9
• ELECTRICAL SPECIFICATIONS

  10
• ABSOLUTE MAXIMUM RATINGS

  10
• OPERATING CONDITIONS

  10
• GENERAL PURPOSE I/O

  10
• MODULE RESET

  10
• DEBUG & PROGRAMMING

  11
• CLOCKS

  11
• FIRMWARE

  13
• FACTORY IMAGE

  13
• 8.1.1 Firmware Version ‘AA’

  13
• 8.1.2 Firmware Version ‘AB’

  13
• 8.1.3 Module Programming and Read-Back Protection

  13
• SOFTDEVICES

  14
• 8.2.1 S132

  14
• 8.2.2 S212

  14
• 8.2.3 S332

  15
• MAC ADDRESS INFO

  15
• MECHANICAL DATA

  16
• MECHANICAL DIMENSIONS

  16
• 9.1.1 BMD-300 Dimensions

  16
• 9.1.2 BMD-301 Dimensions

  16
• 9.1.3 BMD-350 Dimensions

  17
• RECOMMENDED PCB LAND PADS

  17
• 9.2.1 BMD-300/301

  17
• 9.2.2 BMD-350

  18
• MODULE MARKING

  18
• BMD-300 MODULE MARKING

  18
• BMD-301 MODULE MARKING

  19
• BMD-350 MODULE MARKING

  19
• RF DESIGN NOTES

  20
• RECOMMENDED RF LAYOUT & GROUND PLANE

  20
• 11.1.1 BMD-300

  20
• 11.1.2 BMD-301

  20
• 11.1.3 BMD-350

  20
• MECHANICAL ENCLOSURE

  21
• ANTENNA PATTERNS

  22
• 11.3.1 BMD-300

  22
• 11.3.2 BMD-350

  24
• EVALUATION BOARDS

  25
• CUSTOM DEVELOPMENT

  25
• BLUETOOTH QUALIFICATION

  26
• REGULATORY STATEMENTS

  26
• FCC STATEMENT:

  26
• FCC IMPORTANT NOTES:

  30
• IC STATEMENT:

  28
• IC IMPORTANT NOTES:

  28
• CE REGULATORY:

  29
• JAPAN (MIC)

  29
• AUSTRALIA / NEW ZEALAND

  30
• APPROVED EXTERNAL ANTENNAS

  30
• SOLDER REFLOW TEMPERATURE-TIME PROFILE

  31
• MOISTURE SENSITIVITY LEVEL

  31
• PACKAGING AND LABELING

  31
• CARRIER TAPE DIMENSIONS

  31
• 17.1.1 BMD-300 & BMD-301

  31
• 17.1.2 BMD-350

  32
• REEL PACKAGING

  32
• PACKAGING LABEL

  33
• CAUTIONS

  33
• LIFE SUPPORT POLICY

  33
• DOCUMENT HISTORY

  34
• RELATED DOCUMENTS

  34