Cypress CY7C6431x Manual Do Utilizador

Document Number: 001-12394 Rev *G

Page 23 of 28

This section illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each
package.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V emulation tools and their dimensions, refer to the development kit.

001-09116 *D