Intel Xeon X3450 BX80605X3450 Manual Do Utilizador

Intel® Xeon® Processor 3400 Series Datasheet, Volume 1

9

The Intel

®

 Xeon

®

 processor 3400 series are the next generation of 64-bit, multi-core 

processors built on 45-nanometer process technology. Based on the low-power/high-
performance Intel

®

 Core™2 micro-architecture, the processor is designed for a two-

chip platform, as opposed to the traditional three-chip platforms (processor, (G)MCH, 
and ICH). The two-chip platform consists of a processor and Platform Controller Hub 
(PCH) and enables higher performance, easier validation, and improved x-y footprint. 
The Intel

®

 3400 Series Chipset component for servers is the PCH.  The processor is 

designed for UP server platforms.

This document provides DC electrical specifications, signal integrity, differential 
signaling specifications, pinout and signal definitions, interface functional descriptions, 
and additional feature information pertinent to the implementation and operation of the 
processor on its respective platform.

Throughout this document, the Intel

®

 Xeon

®

 processor 3400 series may be referred to 

as “processor”.

Throughout this document, the Intel

®

 Xeon

®

 processor 3400 series refers to the Intel

®

 

Xeon

®

 X3470, X3460, X3450, X3440, X3430, and L3426 processors.

Througout this document, the Intel

®

 3400 Series Chipset Platform Controller Hub may 

also be referred to as “PCH”. 

Some processor features are not available on all platforms. Refer to the processor 

specification update for details.

Included in this family of processors is an integrated memory controller (IMC) and 
integrated I/O (IIO) (such as PCI Express* and DMI) on a single silicon die. This single 
die solution is known as a monolithic processor. For specific features supported on 
individual Intel Xeon processor 3400 series SKUs, refer to the Intel

 Shows an example platform block 

diagram.