Intel D425KT BOXD425KT Manual Do Utilizador
Códigos do produto
BOXD425KT
Intel Desktop Board D425KT and Intel Desktop Board D425KTW Technical Product
Specification
Specification
52
2.5
Electrical Considerations
2.5.1
Fan Header Current Capability
Table 27 lists the current capability of the fan header.
Table 27. Fan Header Current Capability
Fan Header
Maximum Available Current
Chassis fan
1.5 A
2.5.2
Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for the PCI
Conventional slot. The total +5 V current draw for the PCI Conventional expansion
slot (total load) must not exceed 2 A.
Conventional slot. The total +5 V current draw for the PCI Conventional expansion
slot (total load) must not exceed 2 A.
2.6
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38
o
C at the processor fan
inlet is a requirement.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel Desktop Boards please refer to the
following website:
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel Desktop Boards please refer to the
following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.