Intel D425KT BOXD425KT Manual Do Utilizador
Códigos do produto
BOXD425KT
Intel Desktop Board D425KT and Intel Desktop Board D425KTW Technical Product
Specification
Specification
54
Table 28. Thermal Considerations for Components
Component
Maximum Case Temperature
Intel Atom processor
99
o
C
Processor voltage regulator area
85
o
C
Intel NM10 Express Chipset
113
o
C
Memory SO-DIMM
85
o
C
For information about
Refer to
Processor datasheets and specification updates
2.6.1
Passive Heatsink Design in a Passive System
Environment
This section highlights important guidelines and related thermal boundary conditions
for passive heatsink design in a passive system environment. Passive heatsink
describes a thermal solution without a fan attached. Passive system environment
describes a chassis with either a power supply fan or a built-in chassis fan.
for passive heatsink design in a passive system environment. Passive heatsink
describes a thermal solution without a fan attached. Passive system environment
describes a chassis with either a power supply fan or a built-in chassis fan.
This information should be used in conjunction with the Thermal/Mechanical
Specifications and Design Guidelines (TMSDG) published for Intel
Specifications and Design Guidelines (TMSDG) published for Intel
®
Atom™
D400 and
D500 Series processors. The TMSDG contains detailed package information and
thermal mechanical specifications for the processors. The TMSDG also contains
information on how to enable a completely fanless design provided the right usage
scenario and boundary conditions are observed for optimal thermal design. While the
TMSDG has a section on thermal design for passive system environments
(pages 29-30), the information in this section can also be used to complement the
TMSDG.
thermal mechanical specifications for the processors. The TMSDG also contains
information on how to enable a completely fanless design provided the right usage
scenario and boundary conditions are observed for optimal thermal design. While the
TMSDG has a section on thermal design for passive system environments
(pages 29-30), the information in this section can also be used to complement the
TMSDG.
2.6.1.1
Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink.
temperature should be measured just upstream of a passive heatsink.
T
J
Processor junction temperature.
Ψ
JA
Junction-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
performance using total package power. Defined as (T
J
- T
A
)/TDP.
Note: Heat source must be specified for Ψ measurements.
TIM
Thermal Interface Material: the thermally conductive compound between the heatsink and the
processor die surface. This material fills the air gaps and voids, and enhances the transfer of the heat
from the processor die surface to the heatsink.
processor die surface. This material fills the air gaps and voids, and enhances the transfer of the heat
from the processor die surface to the heatsink.
TDP
Thermal Design Power: a power dissipation target based on worst-case applications. Thermal
solutions should be designed to dissipate the thermal design power.
solutions should be designed to dissipate the thermal design power.
T
A
external
The measured external ambient temperature surrounding the chassis. The external ambient
temperature should be measured just upstream of the chassis inlet vent.
temperature should be measured just upstream of the chassis inlet vent.