Intel BX80635E52697V2 Manual Do Utilizador

Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families, 

209

Datasheet Volume One of Two

 

The processor is packaged in a Flip-Chip Land Grid Array (FCLGA12) package that 

interfaces with the baseboard via an LGA2011-0 socket. The package consists of a 
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is 

attached to the package substrate and core and serves as the mating surface for 

processor component thermal solutions, such as a heatsink. 

 shows a sketch 

of the processor package components and how they are assembled together. Refer to 

the Intel® Xeon® Processor E5-1600/2600/4600 v1 and v2 Product Families Thermal / 
Mechanical Design Guide 

for complete details on the LGA2011-0 socket.

The package components shown in 

1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors

1.

Socket and baseboard are included for reference and are not part of the processor package.

The processor is supported in two package sizes: 

• Package A: 52.5 mm x 45 mm and 
• Package B: 52.5 mm x 51 mm

Below is a table that shows the associated processor SKUs with the package sizes. For 

details on processor SKU information, see 

 

IHS 

Substrate  

 

 

System Board

 

Capacitors  

 

TIM 

LGA2011-0 Socket

Die