u-blox AG WIBEAR11N-SF2 Manual Do Utilizador
ELLA-W1 Antenna trace designs
UBX-16016269
Page 4 of 9
locate, communicate, accelerate
3.2 PCB stack-up
The stack-up used in the reference design is specified in Table 2.
PCB Layer
Material
Thickness
Soldermask Top
Generic LPI Soldermask
25 µm
Top
Copper Foil
35 µm
Dielectric
Pre-preg 2x7628
360 µm
L2
Copper Foil
35 µm
Dielectric
Core
700 µm +/-10%
L3
Copper Foil
35 µm
Dielectric
Pre-preg 2x7628
360 µm
Bottom
Copper Foil
35 µm
Soldermask Bottom
Generic LPI Soldermask
25 µm
Table 2: Stack-up of EVK-ELLA-W1
3.2.1 RF trace specification
The 50 Ω coplanar micro-strip dimensions used in these reference designs are stated in Figure 2 and Table 3.
Figure 3: Coplanar micro-strip dimension specification
Item
Value
S
400 µm
W
600 µm
T
35 µm
H
360 µm
Table 3: Coplanar micro-strip specification