Xplore Technologies Corp. MC7750 Manual Do Utilizador
Product Technical Specification & Customer Design Guidelines
56
Proprietary and Confidential - Contents subject to change
2400074
Thermal considerations
Embedded modules can generate significant amounts of heat that must be
dissipated in the host device for safety and performance reasons.
dissipated in the host device for safety and performance reasons.
Figure 8-4: Shield locations
The amount of thermal dissipation required depends on:
•
Supply voltage — See
on page 45 for details of max power
dissipation for various operating modes.
•
Usage — Typical power dissipation values depend on the location within the
host, amount of data transferred, etc.
host, amount of data transferred, etc.
Specific areas requiring heat dissipation are shown in
:
•
Transmitter — Top face of module near RF connectors. Likely to be the hottest
area.
area.
•
Baseband 1 —Top face of module, below the transmitter.
•
Receiver — Bottom face of module, behind the transmitter.
•
Baseband 2 — Bottom face of module, behind Baseband 1.
To enhance heat dissipation:
•
Maximize airflow over / around the module.
•
Locate the module away from other hot components.
•
If possible, use the mounting holes to attach (ground) the device to the main
PCB ground or a metal chassis.
PCB ground or a metal chassis.
Note: Adequate dissipation of heat is necessary to ensure that the module functions
properly, and to comply with the thermal requirements in [11] PCI Express Mini Card
Electromechanical Specification Revision 1.2.
properly, and to comply with the thermal requirements in [11] PCI Express Mini Card
Electromechanical Specification Revision 1.2.
Caution:
Thermal putty is not recommended — incorrect application of the material could
require exessive pressure to be applied when seating the board, resulting in damage to the
board.
board.
Transmitter
Baseband 1
Baseband 2
Receiver
Top Bottom
Pin 1
Pin 1