Digi International Inc XBEEPRO2 Manual Do Utilizador
XBee®/XBee‐PRO® ZB RF Modules
© 2011 Digi International, Inc.
10
Hardware Specs for Programmable Variant
The following specifications need to be added to the current measurement of the previous table if the module
has the programmable secondary processor. For example, if the secondary processor is running and
constantly collecting DIO samples at a rate while having the RF portion of the XBEE sleeping the new current
will be I
has the programmable secondary processor. For example, if the secondary processor is running and
constantly collecting DIO samples at a rate while having the RF portion of the XBEE sleeping the new current
will be I
total
= I
r2
+ I
0
, where I
r2
is the runtime current of the secondary processor and I
s
is the sleep current
of the RF portion of the module of the XBEE-PRO (S2B) listed in the table below.
Mechanical Drawings
Mechanical drawings of the XBee®/XBee‐PRO® ZB RF Modules (antenna options not shown)
.
Australia
C-Tick
C-Tick
C-Tick
Japan
R201WW07215215
R201WW08215142 (international
variant)
R201WW10215062 (international variant)
RoHS
Compliant
Compliant
Compliant
Specifications of the programmable secondary processor
Optional Secondary Processor Specification
These numbers add to S2B specifications
(Add to RX, TX, and sleep currents depending on
mode of operation)
Runtime current for 32k running at 20MHz
+14mA
Runtime current for 32k running at 1MHz
+1mA
Sleep current
+0.5uA typical
For additional specifications see Freescale Datasheet and
Manual
MC9SO8QE32
Minimum Reset low pulse time for EM250
+50 nS (additional resistor increases minimum time)
VREF Range
1.8VDC to VCC
Specifications of the XBee®/XBee‐PRO® ZB RF Module
Specification
XBee
XBee-PRO (S2)
XBee-PRO (S2B)