Digi International Inc XBEEPRO2 Manual Do Utilizador
XBee®/XBee‐PRO® ZB RF Modules
© 2011 Digi International, Inc.
14
EM250 Pin Mappings
The following table shows how the EM250 pins are used on the XBee.
* NOTE: These lines may not go to the external XBEE pins of the module if the programmable secondary processor
is populated.
is populated.
Design Notes
The XBee modules do not specifically require any external circuitry or specific connections for proper
operation. However, there are some general design guidelines that are recommended for help in
troubleshooting and building a robust design.
operation. However, there are some general design guidelines that are recommended for help in
troubleshooting and building a robust design.
Power Supply Design
Poor power supply can lead to poor radio performance especially if the supply voltage is not kept within
tolerance or is excessively noisy. To help reduce noise a 1uF and 8.2pF capacitor are recommended to be
placed as near to pin1 on the PCB as possible. If using a switching regulator for your power supply, switching
frequencies above 500kHz are preferred. Power supply ripple should be limited to a maximum 250mV peak to
peak.
tolerance or is excessively noisy. To help reduce noise a 1uF and 8.2pF capacitor are recommended to be
placed as near to pin1 on the PCB as possible. If using a switching regulator for your power supply, switching
frequencies above 500kHz are preferred. Power supply ripple should be limited to a maximum 250mV peak to
peak.
Note – For designs using the programmable modules an additional 10uF decoupling cap is recommended near
pin 1 of the module. The nearest proximity to pin 1 of the 3 caps should be in the following order: 8.2pf, 1uF
followed by 10uF.
pin 1 of the module. The nearest proximity to pin 1 of the 3 caps should be in the following order: 8.2pf, 1uF
followed by 10uF.
EM250 Pin Number XBee Pin Number
Other Usage
13 (Reset)
5*
Connected to pin 8 on 2x5 SIF header.
19 (GPIO 11)
16*
20 (GPIO 12)
12*
21 (GPIO 0)
15
22 (GPIO 1)
XBee
Tied to ground (module identification)
XBee-PRO (S2)
Low-asserting shutdown line for output power compensation circuitry.
XBee-PRO (S2B)
Used to communicate with Temp Sensor and control Shutdown for low power mode.
Tied to ground (module identification)
XBee-PRO (S2)
Low-asserting shutdown line for output power compensation circuitry.
XBee-PRO (S2B)
Used to communicate with Temp Sensor and control Shutdown for low power mode.
24 (GPIO 2)
XBee
Not connected. Configured as output low.
XBee-PRO (S2)
Powers the output power compensation circuitry.
XBee-PRO (S2B)
Used to communicate with Temp Sensor and control Shutdown for low power mode.
Not connected. Configured as output low.
XBee-PRO (S2)
Powers the output power compensation circuitry.
XBee-PRO (S2B)
Used to communicate with Temp Sensor and control Shutdown for low power mode.
25 (GPIO 3)
13
26 (GPIO 4 / ADC 0)
20
Connected to pin 9 on 2x5 SIF header.
27 (GPIO 5 / ADC 1)
19
Connected to pin 10 on 2x5 SIF header.
29 (GPIO 6 /ADC 2)
18
30 (GPIO 7 / ADC 3
17
31 (GPIO 8)
4
32 (GPIO 9)
2*
33 (GPIO 10)
3*
34 (SIF_CLK)
Connected to pin 6 on 2x5 SIF header.
35 (SIF_MISO)
Connected to pin 2 on 2x5 SIF header.
36 (SIF_MOSI)
Connected to pin 4 on 2x5 SIF header.
37 (SIF_LOAD)
Connected to pin 7 on 2x5 SIF header.
40 (GPIO 16)
7
41 (GPIO 15)
6
42 (GPIO 14)
9
43 (GPIO 13)
11