Linear Technology LTM8048 Demo Board, 725VDC Isolated µModule, 4.5V ≤ VIN ≤ 30V, VOUT = 5V @ 110mA to 370mA, LDO Post-Regulated Flyback Li DC1560A Ficha De Dados
Códigos do produto
DC1560A
LTM8048
15
8048ff
Figure 2.
8048 F02
µMODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION
AMBIENT
CASE (BOTTOM)-TO-BOARD
RESISTANCE
APPLICATIONS INFORMATION
A graphical representation of these thermal resistances
is given in Figure 2.
The blue resistances are contained within the µModule
The blue resistances are contained within the µModule
converter, and the green are outside.
The die temperature of the LTM8048 must be lower than
The die temperature of the LTM8048 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8048. The bulk of the heat flow out of the LTM8048
is through the bottom of the module and the BGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.