Freescale Semiconductor Demonstration Board DEMO9S08AC60E Manual Do Utilizador

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DEMO9S08AC60E User’s Guide, Rev. 0.1
Freescale Semiconductor
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1.8.1  Integrated BDM
The DEMO9S08AC60E features an integrated USB-BDM debugger from P&E 
Microcomputer Systems. All necessary signals are provided via the integrated 
debugger. A USB type B connector (J33) provides the connection between the 
DEMO9S08AC60E and your host PC. 
The integrated debugger provides the DEMO9S08AC60E with power 
eliminating the need to power the board externally. Power is derived from the 
USB bus, therefore total current consumption should not exceed 500mA. 
Excessive current drain will violate the USB spec and damage to your Host 
PC’s USB hub or the DEMO9S08AC60E could occur. 
1.8.2  BDM Header
J32 is the stand alone BDM header. Use of this port requires the user to solder 
a 2 x 6 100 mil center header on the board. The pinout is as follows:
Table 1-2 BDM Connector (J32) Pinout
BKGD
1
2
GND
NC
3
4
RESET_B
NC
5
6
VDD
1.8.3  Socketed MCU
The MC9S08AC60 silicon is socketed on the DEMO9S08AC60E board. This 
socket is an open top, spring actuated, 0.8mm pitch socket. It is made by Wells 
Electronics, part number 7314-064-0-08. Before connecting power to the demo 
board the silicon should be installed in this socket. Using your thumb and index 
finger, press down on the socket until it is fully actuated. Place the silicon in the 
socket with a vacuum pen or other chip lifting device. Pin 1 of the silicon 
(denoted by an indented dot) should be in the bottom left hand corner, towards 
the USB connector J33. Release the socket. The MC9S08AC60 silicon should 
be centered within the socket and firmly held in place.