Intel Xeon X3440 BX80605X3440 Manual Do Utilizador
Códigos do produto
BX80605X3440
1U Collaboration Thermal Solution
60
Collaboration thermal solution Ψca(mean+3sigma) is computed to 0.319°C/W at the
airflow of 15 CFM. As the
shown when T
LA
is 40 °C, equation representing
thermal solution of this heatsink is calculated as:
Y=0.319*X+40
where,
Y=Processor T
CASE
Value (°C)
X=Processor Power Value (W)
shows thermal solution performance is compliant with Intel
®
Xeon
®
processor 3400 series(95W) TTV thermal profile specification. At the TDP(95W) with
local ambient of 40°C, there is a 2.4 °C margin.
local ambient of 40°C, there is a 2.4 °C margin.
Note:
Intel
®
Xeon
®
processor 3400 series (95W) TTV thermal profile is the worst case of
LGA1156 Processors.
Figure 8-1. 1U Heatsink Performance Curves