Справочник Пользователя для Intel Xeon X3440 BX80605X3440

Модели

BX80605X3440

1U Collaboration Thermal Solution

Collaboration thermal solution Ψca(mean+3sigma) is computed to 0.319°C/W at the

airflow of 15 CFM. As the

shown when T

is 40 °C, equation representing

thermal solution of this heatsink is calculated as:

Y=0.319*X+40

where,

Y=Processor T

CASE

Value (°C)

X=Processor Power Value (W)

shows thermal solution performance is compliant with Intel

Xeon

processor 3400 series(95W) TTV thermal profile specification. At the TDP(95W) with
local ambient of 40°C, there is a 2.4 °C margin.

Note:

Intel

Xeon

processor 3400 series (95W) TTV thermal profile is the worst case of

LGA1156 Processors.

Figure 8-1. 1U Heatsink Performance Curves