Intel 4 551 BX80547PG3400EK Manual Do Utilizador

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The Pentium 4 processor on 90 nm process in the 775-land package will also be offered as a boxed 
Intel processor. Boxed Intel processors are intended for system integrators who build systems from 
baseboards and standard components. The boxed Pentium 4 processor in the 775-land package will 
be supplied with a cooling solution. This chapter documents baseboard and system requirements 
for the cooling solution that will be supplied with the boxed Pentium 4 processor in the 775-land 
package. This chapter is particularly important for OEMs that manufacture baseboards for system 
integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and 
inches [in brackets]. 

 shows a mechanical representation of a boxed Pentium 4 processor 

in the 775-land package.

Drawings in this section reflect only the specifications on the boxed Intel processor product. These 
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system 
designers’ responsibility to consider their proprietary cooling solution when designing to the 
required keep-out zone on their system platforms and chassis. Refer to the Intel

Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines for further 
guidance. Contact your local Intel Sales Representative for this document.

 

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.