Intel 4 551 BX80547PG3400EK Manual Do Utilizador

Códigos do produto
BX80547PG3400EK
Página de 96
90
 
Datasheet
Boxed Processor Specifications
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Pentium 4 processor on 90 nm 
process in the 775-land package. The boxed processor will be shipped with an unattached fan 
heatsink. 
 shows a mechanical representation of the boxed Pentium 4 processor in the 
775-land package. 
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The 
physical space requirements and dimensions for the boxed processor with assembled fan heatsink 
are shown in 
 (side view), and 
 (top view). The airspace requirements for the 
boxed processor fan heatsink must also be incorporated into new baseboard and system designs. 
Airspace requirements are shown in 
 and 
. Note that some figures have 
centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. 
NOTES:
1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical 
representation.
Figure 7-2. Space Requirements for the Boxed Processor (Side View)
Figure 7-3. Space Requirements for the Boxed Processor (Top View)
3.74
[95.0]
3.2
[81.3]
0.39
[10.0]
0.98
[25.0]
3.74
[95.0]
3.74
[95.0]