Manual Do Utilizadoríndice analíticoTable of Figures5Functional Overview6Microcontroller6SPI Flash Memory6WLAN7Bluetooth7Antennas7Block Diagram8Module Pin Descriptions9Pin Descriptions9Pin Definitions10Electrical Specifications11Absolute Maximum Ratings11Recommended Operating Conditions11Power Supply Requirements11WLAN Power Consumption12Bluetooth Power Consumption12Bluetooth Low Energy Power Consumption12Low Power Modes Power Consumption12RF Specifications13WLAN RF Characteristics13Transmitter Specification14Receiver Specification15Bluetooth RF Characteristics17Transmitter Specification17Receiver Specification17BLE RF Characteristics18Mechanical Specifications19Mechanical Size19Module PCB Footprint20Module Pad Size20Recommended Solder Paste Mask21Recommended Solder Mask21Tape and Reel Packaging22Soldering and Cleaning Recommendations23Optimum Soldering Reflow Profile23Cleaning2310 Antennas2411 Certifications25RoHS25Regulatory Compliance25Bluetooth Interoperability Compliance25Regulatory Agency Statements25OEM Instructions26OEM Labeling Requirements26Limitations2612 Shipping, Handling and Storage27Shipping27Handling27Moisture Sensitivity (MSL)27Storage2713 Ordering Information28Module Accessories2814 Contact Information29Figure 1 – AES-BCM4343W-M1-G Module Block Diagram8Figure 2 – AES-BCM4343W-M1-G Module Top View19Figure 3 – AES-BCM4343W-M1-G Module Side View19Figure 4 – AES-BCM4343W-M1-G Module PCB Footprint20Figure 5 – AES-BCM4343W-M1-G Module Pad Size20Figure 6 – Recommended Solder Paste Mask Size21Figure 7 – Recommended Solder Mask Size21Figure 8 – Tape Dimensions22Figure 9 – Recommended Soldering Profile for Lead-Free Solder23Figure 10 – Dual Fractal PCB Antennas24Figure 11 – Test Probe Connectors (Murata SWD series)24Tamanho: 2 MBPáginas: 31Language: EnglishAbrir o manual