Manuais de utilizador para Intel D525

índice analítico

• Intel® Atom™ Processor D400 and D500 Series

  1
• 1 Introduction

  8
  • 1.1 Intel® Atom™ Processor D400 and D500 Series Features

    8
  • 1.2 System Memory Features

    9
  • 1.3 Direct Media Interface Features

    10
  • 1.4 Graphics Processing Unit Features

    10
  • 1.5 Clocking

    11
  • 1.6 Power Management

    11
    • 1.6.1 Terminology

      11
  • 1.7 References

    13
  • 1.8 System Block Diagram

    14
• 2 Signal Description

  15
  • 2.1 CPU Legacy Signal

    16
  • 2.2 System Memory Interface

    19
  • 2.3 DMI - Direct Media Interface

    21
  • 2.4 PLL Signals

    21
  • 2.5 Analog Display Signals

    22
  • 2.6 LVDS Signals

    23
  • 2.7 JTAG/ITP Signals

    24
  • 2.8 Error and Thermal Protection

    24
  • 2.9 Processor Core Power Signals

    25
  • 2.10 Graphics, DMI and Memory Core Power Signals

    25
  • 2.11 Ground

    26
• 3 Functional Description

  27
  • 3.1 System Memory Controller

    27
    • 3.1.1 System Memory Organization Modes

      27
    • 3.1.2 System Memory Technology Supported

      27
    • 3.1.3 Rules for Populating DIMM Slots

      30
  • 3.2 Graphics Processing Unit

    30
    • 3.2.1 3D Graphics Pipeline

      31
    • 3.2.2 Video Engine

      32
    • 3.2.3 2D Engine

      32
    • 3.2.4 Analog Display Port Characteristics

      32
    • 3.2.5 Multiple Display Configurations

      33
  • 3.3 Thermal Sensor

    33
    • 3.3.1 PCI Device 0, Function 0

      33
  • 3.4 Power Management

    34
    • 3.4.1 Main Memory Power Management

      34
    • 3.4.2 Interface Power States Supported

      35
    • 3.4.3 State Combinations

      35
    • 3.4.4 System Suspend States

      35
• 4 Electrical Specifications

  37
  • 4.1 Power and Ground Balls

    37
  • 4.2 Decoupling Guidelines

    37
    • 4.2.1 Voltage Rail Decoupling

      37
  • 4.3 Processor Clocking

    38
  • 4.4 Voltage Identification (VID)

    38
  • 4.5 Catastrophic Thermal Protection

    40
  • 4.6 Reserved or Unused Signals

    40
  • 4.7 Signal Groups

    41
  • 4.8 Test Access Port (TAP) Connection

    41
  • 4.9 Absolute Maximum and Minimum Ratings

    41
  • 4.10 DC Specifications

    43
    • 4.10.1 Flexible Motherboard Guidelines (FMB)

      43
    • 4.10.2 Voltage and Current Specifications

      43
    • 4.10.3 DC Specifications

      46
• 5 Signal Quality Specifications

  53
• 6 Low Power Features

  54
  • 6.1 Low Power States

    54
    • 6.1.1 Processor Core Low Power States

      54
    • 6.1.2 Processor Core C-states Description

      56
• 7 Thermal Specifications and Design Considerations

  58
  • 7.1 Thermal Specifications

    58
    • 7.1.1 Thermal Diode

      59
    • 7.1.2 Intel® Thermal Monitor

      61
    • 7.1.3 Digital Thermal Sensor

      63
    • 7.1.4 Out of Specification Detection

      63
    • 7.1.5 PROCHOT# Signal Pin

      64
• 8 Package Mechanical Specifications and Ball Information

  65
  • 8.1 Package Mechanical Specifications

    65
    • 8.1.1 Package Mechanical Drawings

      65
    • 8.1.2 Package Loading Specifications

      66
  • 8.2 Processor Ballout Assignment

    66
• 9 Debug Tool Specifications

  78
• 10 Testability

  79
  • 10.1 JTAG Boundary Scan

    79