Справочник Пользователя для Intel Server Board S5500HCV S5500HCVR
Модели
S5500HCVR
Intel® Server Boards S5520HC and S5500HCV TPS
Functional Architecture
Revision 1.2
Intel order number E39529-009
25
The BIOS creates entries in the Multi-Processor Specification, Version 1.4 tables to describe
multi-core processors.
multi-core processors.
3.2.8
Direct Cache Access (DCA)
Direct Cache Access (DCA) is a system-level protocol in a multi-processor system to improve
I/O network performance, thereby providing higher system performance. The basic idea is to
minimize cache misses when a demand read is executed. This is accomplished by placing the
data from the I/O devices directly into the processor cache through hints to the processor to
perform a data pre-fetch and install it in its local caches.
I/O network performance, thereby providing higher system performance. The basic idea is to
minimize cache misses when a demand read is executed. This is accomplished by placing the
data from the I/O devices directly into the processor cache through hints to the processor to
perform a data pre-fetch and install it in its local caches.
The BIOS setup provides an option to enable or disable this feature. The default behavior is
enabled.
enabled.
3.2.9
Unified Retention System Support
The server boards comply with Unified Retention System (URS) and Unified Backplate
Assembly. The server boards ship with Unified Backplate Assembly at each processor socket.
Assembly. The server boards ship with Unified Backplate Assembly at each processor socket.
The URS retention transfers load to the server boards via the Unified Backplate Assembly. The
URS spring, captive in the heatsink, provides the necessary compressive load for the thermal
interface material (TIM). All components of the URS heatsink solution are captive to the
heatsink and only require a Phillips* screwdriver to attach to the Unified Backplate Assembly.
See the following figure for the stacking order of URS components.
URS spring, captive in the heatsink, provides the necessary compressive load for the thermal
interface material (TIM). All components of the URS heatsink solution are captive to the
heatsink and only require a Phillips* screwdriver to attach to the Unified Backplate Assembly.
See the following figure for the stacking order of URS components.
The Unified Backplate Assembly is removable, allowing for the use of non-Intel
®
heatsink
retention solutions.
Figure 15. Unified Retention System and Unified Back Plate Assembly