Справочник Пользователя для Mitsubishi Electronics MDS-R

 
 
 

 

 

6 - 11

 

In order to secure reliability and life, design the temperature in the panel so that the ambient 
temperature of each unit is 55°C or less. 
If the heat accumulates at the top of the unit, etc.,

 

install a fan or heat exchanger so that the 

temperature in the panel remains constant.

 

 
 

Please refer to following method for heat radiation countermeasures. 

 

 

[1] Refer to the section “6-5 Heating value” for the heat 

generated by each unit. 

[2] Refer to the following calculation for calculation W1 of the 

panel’s cooling capacity (thin steel plate). 

W1 = U x A x  ΔT 

U: 6W/m

2

 x °C    (with internal agitating fan) 

4W/m

2

 x °C    (without internal agitating fan) 

A: Effective heat radiation area [m

2

] 

（Heat dissipation area in panel） 

Sections contacting other objects are excluded. 

T: Internal temperature rise value (10°C) 

[3] Points in manufacturing and evaluation 

Understanding the temperature rise in the panel, and 

install a fan or heat exchanger. 

T (average value) 10°C 
T

max

 (maximum value) 

15°C 

[1] Average temperature in panel: T 

55°C 

[2] Panel peripheral temperature: Ta 

0 to 45°C 

[3] Internal temperature rise value: 

T=T-Ta

max 

=10°C 

Calculate total heat radiation of each

unit in panel (W) 

Manufacturing and evaluation 

W 



W1 

W>W1 

ΔT > 10℃ 

ΔT 



10℃ 

Completion 

Evaluate temperature 

in panel 

Comparison of   

W and W1 

Calculate panel’s cooling capacity 

(W1)

 

Consider heat 

exchanger 

Consider adding fan or 

heat exchanger 

 

 
 
Examples of mounting heat exchanger and temperature measurement positions (reference) 
 

 

Temperature measurement positions 

He

a

t 

ex

c

han

g

er

 

Heat 
exchanger

Unit 

Relay, etc 

Unit

 

Flow of air 

Flow of air

Relay, etc