Справочник Пользователя для Intel SE7520JR2
Design and Environmental Specifications
Intel® Server Board SE7520JR2
Revision 1.0
C78844-002
202
8. Design and Environmental Specifications
8.1 Server Board SE7520JR2 Design Specification
Operation of the Server Board SE7520JR2 at conditions beyond those shown in the following
table may cause permanent damage to the system. Exposure to absolute maximum rating
conditions for extended periods may affect system reliability.
table may cause permanent damage to the system. Exposure to absolute maximum rating
conditions for extended periods may affect system reliability.
Table 112: Board Design Specifications
Operating Temperature
5º C to 50º C
1
(32º F to 131º F)
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 50 g, 170 inches/sec
Shock (Packaged) (≥ 40 lbs to < 80 lbs)
24 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
1.
1.
Chassis design must provide proper airflow to avoid exceeding Intel Xeon processor
maximum case temperature.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of air
flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
8.2 Power Supply Requirements
Note: The information provided in this section was derived from Intel’s 500W power supply
specification designed for use in the Server Chassis SR1400. The figures provided and the values
in the tables are meant for reference purposes only and are based on a 1U rack server
configuration. Variations in system configurations may produce different values.
specification designed for use in the Server Chassis SR1400. The figures provided and the values
in the tables are meant for reference purposes only and are based on a 1U rack server
configuration. Variations in system configurations may produce different values.
8.2.1 Output
Connectors
Listed or recognized component appliance wiring material (AVLV2), CN, rated min 105
°
C,
300Vdc shall be used for all output wiring.