Справочник Пользователя для Intel SE7520JR2

Revision 1.0 

This appendix contains important terms used in the preceding chapters.  For ease of use, 
numeric entries are listed first (e.g., “82460GX”) with alpha entries following (e.g., “AGP 4x”).  
Acronyms are then entered in their respective place, with non-acronyms following. 

ACPI Advanced 

Configuration and Power Interface 

AP Application 

Processor 

APIC 

Advanced Programmable Interrupt Control 

ASIC application 

specific integrated circuit 

BIOS 

Basic input/output system 

BIST 

Built-in self test 

BMC 

Sahalee Baseboard Management Controller 

Bridge 

Circuitry connecting one computer bus to another, allowing an agent on one to access the other. 

BSEL  
BSP Bootstrap 

processor 

byte 8-bit 

quantity. 

CBC 

Chassis bridge controller. A microcontroller connected to one or more other CBCs. Together they 
bridge the IPMB buses of multiple chassis. 

CEK 

Common Enabling Kit 

CHAP 

Challenge Handshake Authentication Protocol 

CMOS 

In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes 
of memory, which normally resides on the baseboard. 

DPC 

Direct Platform Control 

EEPROM 

Electrically erasable programmable read-only memory 

EHCI 

Enhanced Host Controller Interface 

EMP 

Emergency management port. 

EPS 

External Product Specification 

FMB 

Flexible Mother Board 

FMC 

Flex Management Connector 

FMM 

Flex Management Module 

FRB 

Fault resilient booting 

FRU 

Field replaceable unit 

FSB 

Front side Bus 

GB 1024 

MB. 

GPIO 

General purpose I/O 

GTL 

Gunning Transistor Logic 

HSC Hot-swap 

controller 

Hz 

Hertz (1 cycle/second) 

I2C 

Inter-integrated circuit bus 

IA Intel® 

architecture 

IBF Input 

buffer 

ICH 

I/O controller hub 

ICMB 

Intelligent Chassis Management Bus 

IERR Internal 

error