Справочник Пользователя для Intel S5000PSL

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Design and Environmental Specifications 
Intel® Server Boards S5000PSL and S5000XSL TPS 
 
  
Revision 
1.2 
Intel order number: D41763-003 
66 
 
5.6 Fan 
Headers 
The server board provides four SSI-compliant 4-pin and four SSI-compliant 6-pin fan headers to 
be used as CPU, and IO cooling fans. 3-pin fans are supported on all fan headers. 6-pin fans 
are supported on header J3H4, J3H3, J3H2, and J3H1.  4-pin fans are supported on header 
J9J1, J5J1, J3H4, J3H3, J9B4, and J9B3.  4-pin fans are not supported on header J3H2, and 
J3H1, since these headers are tied to the CPU1 PWM.  These fan headers should also not be 
used for CPU cooling fans. The pin configuration for each of the 4-pin and 6-pin fan headers is 
identical and is defined in the following tables. 
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Two 4-pin fan headers are designated as processor cooling fans:  
-  CPU1 fan (J9J1) 
-  CPU2 fan (J5J1) 
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Four 6-pin fan headers are designated as hot-swap system fans:  
-  Hot-swap system fan 1 (J3H4) 
-  Hot-swap system fan 2 (J3H3) 
-  Hot-swap system fan 3 (J3H2) 
-  Hot-swap system fan 4 (J3H1) 
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Two 4-pin fan headers are designated as rear system fans:  
-  System fan 5 (J9B4) 
-  System fan 6 (J9B3) 
Table 33. SSI 4-pin Fan Header Pin-out (J9J1, J5J1, J9B3, J9B4) 
Pin 
Signal Name 
Type 
Description 
Ground 
GND 
Ground is the power supply ground 
12V 
Power 
Power supply 12 V 
Fan Tach 
In 
FAN_TACH signal is connected to the BMC to monitor the fan speed  
Fan PWM 
Out 
FAN_PWM signal to control fan speed 
 
Table 34. SSI 6-pin Fan Header Pin-out (J3H1, J3H2, J3H3, J3H4) 
Pin 
Signal Name 
Type 
Description 
Ground 
GND 
Ground is the power supply ground 
12V 
Power 
Power supply 12 V 
Fan Tach 
In 
FAN_TACH signal is connected to the BMC to monitor the fan speed  
Fan PWM 
Out 
FAN_PWM signal to control fan speed 
5 Fan 
Presence 
In Indicates the fan is present 
Fan Fault LED 
Out 
Lights the fan fault LED 
 
Note: Intel Corporation server boards support peripheral components and contain a number of 
high-density VLSI and power delivery components that need adequate airflow to cool. Intel’s 
own chassis are designed and tested to meet the intended thermal requirements of these