Справочник Пользователя для Intel E8501
Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
17
Bridge (XMB) Thermal/Mechanical Design Guide
4
Thermal Simulation
Intel provides thermal simulation models of the E8500/E8501 chipset NB/XMB components and
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
ICEPAK* format. Contact your Intel field sales representative to order the thermal models and
user's guides.
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
ICEPAK* format. Contact your Intel field sales representative to order the thermal models and
user's guides.
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