Справочник Пользователя для Intel E8500

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Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned 
with the direction of the heatsink fins.

The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB. 

 shows the heatsink profile. 

 lists a supplier for this extruded heatsink. Other 

heatsinks with similar dimensions and increased thermal performance may be available. Full 
mechanical drawing of this heatsink is provided in 

.

There is no mechanical interface material associated with this reference solution.

A TIM provides improved conductivity between the die and heatsink. The reference thermal 
solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm 
(1.5 in. x 1.5 in.) square. 

Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch. 
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch 
after it reaches its phase change temperature.

As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This 
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled 
thickness of the thermal interface material after installation of heatsink. The effect of pressure on