Справочник Пользователя для Intel E8500
NB Reference Thermal Solution #1
28
Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in
The
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17
°C
inch
2
/W.
NOTE:
1. All measured at 50°C.
6.5.5
Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the
motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.
These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two
NB reference thermal solutions. See
motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.
These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two
NB reference thermal solutions. See
for a mechanical drawing of the fastener.
Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure
Pressure (psi)
Thermal Resistance (°C × in
2
)/W
5
0.37
10
0.30
20
0.21
30
0.17
Figure 6-5. First NB Heatsink Extrusion Profile