Справочник Пользователя для Intel E8500
Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
33
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #2
7.4
Board-Level Components Keepout Dimensions
7.5
Second NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners.
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners.
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
contains vendor information for each thermal solution component.
Figure 7-2. Second NB Reference Heatsink Volumetric Envelope
H e a t s i n k
F i n
4 2 .5 0 m m .
H e a t s in k B a s e
64
.5
2 m
m
.
6 4 .5 2 m m .
H e a t s in k B a s e
IH S + T IM 2
55
.0
9
m
m
.
M o th e r b o a r d
H e a t s i n k
F i n
4
mm.
4.
29
m
m
.
F C B G A
4
0
.50 m
m
.