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NB Reference Thermal Solution #2
34
Intel
®
 E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
7.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned 
with the direction of the heatsink fins.
7.5.2
Extruded Heatsink Profiles
Please refer to 
 for detail.
7.5.3
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.4
Thermal Interface Material
Please refer to 
 for detail.
7.5.4.1
Effect of Pressure on TIM Performance
Please refer to 
 for detail.
7.5.5
Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to 
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting 
holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with 
either of the two NB reference thermal solutions. See 
 
for a mechanical drawing of the 
fastener.
Figure 7-3. Second NB Heatsink Assembly