Справочник Пользователя для Intel 632xESB
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
February 2007
TMDG
15
Thermal Solution Requirements—Intel
®
6321ESB ICH
If the local ambient temperature is relaxed to 45° C, the same calculation can be
carried out to determine the new case-to-ambient thermal resistance:
It is evident from the above calculations that a reduction in the local ambient
temperature has a significant effect on the case-to-ambient thermal resistance
requirement. This effect can contribute to a more reasonable thermal solution including
reduced cost, heat sink size, heat sink weight, and a lower system airflow rate.
summarizes the thermal budget required to adequately cool the Intel
®
6321ESB I/O Controller Hub in one configuration using a TDP of 12.4 W. Further
calculations would need to be performed for different TDPs. Since the results are based
on air data at sea level, a correction factor would be required to estimate the thermal
performance at other altitudes.
Ψ
SA
Ψ
CA
Ψ
CS
–
3.23
0.35
–
2.88
°
C
W
----
=
=
=
Ψ
CA
T
C
T
LA
–
TDP
-----------------
105
45
–
12.4
---------------
4.84
°
C
W
----
=
=
=
Table 4.
Required Heat Sink Thermal Performance (Ψ
CA
)
Device
Ψ
CA
(º C/W) at T
LA
= 45º C
Ψ
CA
(º C/W) at T
LA
= 65º C
Intel
®
6321ESB I/O Controller
Hub @ 12.4 W
4.84
3.23