Справочник Пользователя для Intel 632xESB
Intel
®
6321ESB ICH—Reference Thermal Solution
Intel
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
TMDG
February 2007
20
7.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel
®
6321ESB ICH thermal solution are shown in
.
When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub
, any motherboard components placed
between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.
Figure 9.
Torsional Clip Heatsink Measured Thermal Performance Versus Approach
Velocity and Target at 65C Local-Ambient
0.000
1.000
2.000
3.000
4.000
5.000
6.000
7.000
8.000
0
50
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400
LFM through fin area
P
s
i-
ca
(
m
ea
n
p
lu
s
2.
3
si
g
m
a
) [
C
/W
]
Therm al Target
Sim ulation res ults with
EOLife TIM perform ance
EOLife TIM perform ance