Справочник Пользователя для Nxp Semiconductors TFA9812
TFA9812_2
© NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 02 — 22 January 2009
43 of 66
NXP Semiconductors
TFA9812
BTL stereo Class-D audio amplifier with I
2
S input
[1]
V
ss
= V
SS1
= V
SS2
= REFA = REFD
12. Thermal characteristics
[1]
Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7).
[2]
Measured in free air with natural convection.
[3]
Strongly depends on where measurement is made on the case: worst-case value stated.
V
x
voltage on pin x
DIAG
V
SS
−
0.3
V
SS
+ 12
V
POWERUP
V
SS
−
0.3
V
DDA
+ 0.3
V
ENABLE, GAIN, CSEL,
ADSEL2/PLIM2,
ADSEL2/PLIM1, SCL/SFOR,
SDA/MS, DATA, WS, BCK,
MCLK
ADSEL2/PLIM2,
ADSEL2/PLIM1, SCL/SFOR,
SDA/MS, DATA, WS, BCK,
MCLK
V
SS
−
0.5
V
SS
+ 5.5
V
AVOL
V
SS
−
0.5
V
SS
+ 4.6
V
V
esd
electrostatic discharge voltage
according to the human body model
STAB1 and STAB2 with
respect to other pins
respect to other pins
−
1750
+1750
V
all other pins
−
2
+2
kV
according to the charge
device model
device model
−
500
+500
V
Table 53.
Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Table 54.
Thermal Characteristics
Symbol
Parameter
Condition
Min Typ
Max Unit
R
th(j-a)
thermal resistance
from junction to
ambient
from junction to
ambient
No air flow, JEDEC board
-
-
42
K/W
No air flow; typical 4L board in
the NXP 4L reference
application
the NXP 4L reference
application
-
-
36
K/W
No air flow; typical 2L board in
the NXP 2L reference
application
the NXP 2L reference
application
-
-
42
K/W
R
th(j-c)
thermal resistance
from junction to case
from junction to case
5
-
-
K/W
R
th(j-lead)
thermal resistance
from junction to lead
from junction to lead
Worst-case pin
5
-
-
K/W