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Document Number: 002-xxxxx Rev. ** 
Page 8 of 42
PRELIMINARY
CYBLE-013025-00
CYBLE-013030-00
Module Connections
  and 
  detail  the  solder  pad  connection  definitions  and  available  functions  for  the  pad  connections  for  the
CYBLE-013025-00 and CYBLE-013030-00 respectively
 and 
 lists the solder pads on the CYBLE-0130XX-00 modules,
the silicon device pin, and denotes what functions are available for each solder pad.
Table 4. CYBLE-013025-00 Solder Pad Connection Definitions
 Pad Num-
ber
Pad Name
UART/SPI/I2C
PWM
GPIO
Other Function
1
XRES
Power Supply Input (3.30V)
2
GND/NC
Ground
Can be NC
3
GND/NC
Ground
Can be NC
4
P11/27
SPI2_MOSI(master/slave)
3
3
ADC input, QOC, XTALI32K
5
P12/26
SPI2_CS(slave)
3
3
ADC input, QOC, XTALO32K
6
P15
3
ADC input, SWDIO, IR_RX
7
P14/38
SPI2_MOSI(master/slave)
3
3
ADC Input, IR_TX
8
P13/28
3
3
ADC input, QOC, IR_TX
9
P24
PUART_RX,SPI2_CLK(master/
slave))
3
10
NC
Not Connect
11
NC
Not Connect
12
P25
PUART_RX,SPI2_MISO(maste
r/slave)
3
13
P4
PUART_RX,SPI2_MOSI(maste
r/slave)
3
IR_TX, Q_Y0
14
P2
PUART_RX,SPI2_MOSI(maste
r)/SPI2_CS(slave)
3
QDX0
15
VDD
VDD
16
P3
PUART_CTS,SPI2_CLK(maste
r/slave)
3
QDX1
17
P8/33
3
ADC input, TX_PD, QDX1,ACLK1
18
P32
3
ADC input, ACLK0
19
P1
PUART_RTS,SPI2_MISO
3
ADC input, IR_TX
20
P0
PUART_TX,SPI2_MOSI(master
/slave)
3
ADC input, IR_RX
21
SDA
I2C_SDA
3
22
SCL
I2C_SCL
3
23
UP_TX
3
(UART_TXD)
3
24
UP_RX
3
(UART_RXD)
3
25
GND
Ground
26
GND
Ground
27
GND
Ground
28
GND
Ground
29
NC
Not Connect
30
NC
Not Connect
31
NC
Not Connect