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MLK029A
Product Specification
WLAN 11b/g/n WIFI+MT5931 Module
WIFI+BT(1T1R)
Version A1.0
History
Document
release
Data
Modification
Initials
Approved
Version A1.0
2012/08/31
First version
Eddy
Version A2.0
2012/12/12
First version
Eddy
Version A3.0
2013/1/30
First version
Zhiban Qin
1.Overview
Product Description
MLK029A is a small size and low profile of WiFi+BT combo module with LGA
(Land-Grid Array) footprint, board size is 20mm*10mm withmodule height 2mm. It can
be easily manufactured on SMTprocess and highly suitable for tablet PC, ultra book,
mobile device and consumer product. It provides GSPI/SDIO interface for WiFi to
connect with host processor and high speed UART interface for BT. It also has a PCM
interface for audio data transmission with direct link to external audio codec via BT
controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n
b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0
(Land-Grid Array) footprint, board size is 20mm*10mm withmodule height 2mm. It can
be easily manufactured on SMTprocess and highly suitable for tablet PC, ultra book,
mobile device and consumer product. It provides GSPI/SDIO interface for WiFi to
connect with host processor and high speed UART interface for BT. It also has a PCM
interface for audio data transmission with direct link to external audio codec via BT
controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n
b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0
MLK029A uses MT 5931&6622 IC, a highly integrated WiFi/BT single chip based on
advanced COMS process. ICs almost integrates whole WiFi/BT function blocks into a
chip, such as SDIO/UART,MAC,BB, AFE, RFE, PA, EEPROM andLDO/SWR, except
fewer passive components remained on PCB.
advanced COMS process. ICs almost integrates whole WiFi/BT function blocks into a
chip, such as SDIO/UART,MAC,BB, AFE, RFE, PA, EEPROM andLDO/SWR, except
fewer passive components remained on PCB.