Техническая Спецификация для Intel Pentium D 830 HH80551PG0802MN

Модели

HH80551PG0802MN

Datasheet

Contents

Introduction .................................................................................................................................... 11

1.1

Terminology ........................................................................................................................ 12
1.1.1

Processor Packaging Terminology ........................................................................ 12

1.2

References ......................................................................................................................... 13

Electrical Specifications ................................................................................................................. 15

2.1

Power and Ground Lands ................................................................................................... 15

2.2

Decoupling Guidelines ........................................................................................................ 15
2.2.1

VCC Decoupling .................................................................................................... 15

2.2.2

VTT Decoupling ..................................................................................................... 15

2.2.3

FSB Decoupling ..................................................................................................... 16

2.3

Voltage Identification .......................................................................................................... 16

2.4

Reserved, Unused, FC and TESTHI Signals...................................................................... 18

2.5

Voltage and Current Specifications .................................................................................... 19
2.5.1

Absolute Maximum and Minimum Ratings............................................................. 19

2.5.2

DC Voltage and Current Specifications ................................................................. 19

2.5.3

VCC Overshoot Specification ................................................................................ 25

2.5.4

Die Voltage Validation ........................................................................................... 26

2.6

Signaling Specifications ...................................................................................................... 26
2.6.1

FSB Signal Groups ................................................................................................ 26

2.6.2

GTL+ Asynchronous Signals ................................................................................. 28

2.6.3

FSB DC Specifications .......................................................................................... 29

2.7

Clock Specifications............................................................................................................ 32
2.7.1

FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 32

2.7.2

FSB Frequency Select Signals .............................................................................. 32

2.7.3

Phase Lock Loop (PLL) and Filter ......................................................................... 33

Package Mechanical Specifications .............................................................................................. 35

3.1

Package Mechanical Drawing ............................................................................................ 35

3.2

Processor Component Keep-Out Zones............................................................................. 39

3.3

Package Loading Specifications ......................................................................................... 39

3.4

Package Handling Guidelines............................................................................................. 39

3.5

Package Insertion Specifications ........................................................................................ 40

3.6

Processor Mass Specification............................................................................................. 40

3.7

Processor Materials ............................................................................................................ 40

3.8

Processor Markings ............................................................................................................ 40

3.9

Processor Land Coordinates .............................................................................................. 42

Land Listing and Signal Descriptions ............................................................................................ 43

4.1

Processor Land Assignments ............................................................................................. 43

4.2

Alphabetical Signals Reference .......................................................................................... 66

Thermal Specifications and Design Considerations ...................................................................... 75

5.1

Processor Thermal Specifications ...................................................................................... 75
5.1.1

Thermal Specifications .......................................................................................... 75

5.1.2

Thermal Metrology ................................................................................................. 79