Техническая Спецификация для Intel Pentium D 830 HH80551PG0802MN
Модели
HH80551PG0802MN
Datasheet
5
Contents
Figures
2-1 VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Pentium D Processor............ 22
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............ 24
2-3 VCC Overshoot Example Waveform .......................................................................................... 25
2-4 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 34
3-1 Processor Package Assembly Sketch ........................................................................................ 35
3-2 Processor Package Drawing 1 ................................................................................................... 36
3-3 Processor Package Drawing 2 ................................................................................................... 37
3-4 Processor Package Drawing 3 ................................................................................................... 38
3-5 Processor Top-Side Marking Example (Intel
2-2 VCC Static and Transient Tolerance for 775_VR_CONFIG_05B Pentium D Processor............ 24
2-3 VCC Overshoot Example Waveform .......................................................................................... 25
2-4 Phase Lock Loop (PLL) Filter Requirements.............................................................................. 34
3-1 Processor Package Assembly Sketch ........................................................................................ 35
3-2 Processor Package Drawing 1 ................................................................................................... 36
3-3 Processor Package Drawing 2 ................................................................................................... 37
3-4 Processor Package Drawing 3 ................................................................................................... 38
3-5 Processor Top-Side Marking Example (Intel
Pentium
®
D Processors 840, 830, 820) ............. 40
Pentium
®
D Processor 805)............................... 41
3-7 Processor Land Coordinates, Top View ..................................................................................... 42
4-1 Landout Diagram (Top View – Left Side).................................................................................... 44
4-2 Landout Diagram (Top View – Right Side) ................................................................................. 45
5-1 Thermal Profile for the Pentium D Processor with PRB=1 ......................................................... 77
5-2 Thermal Profile for the Pentium D Processor with PRB=0 ......................................................... 78
5-3 Case Temperature (TC) Measurement Location ........................................................................ 79
6-1 Processor Low Power State Machine......................................................................................... 86
7-1 Mechanical Representation of the Boxed Processor.................................................................. 89
7-2 Side View Space Requirements for the Boxed Processor (Applies to all four side views) ......... 90
7-3 Top View Space Requirements for the Boxed Processor........................................................... 90
7-4 Overall View Space Requirements for the Boxed Processor ..................................................... 91
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ........................ 94
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ........................ 94
7-9 Boxed Processor Fan Heatsink Set Points................................................................................. 95
8-1 Mechanical Representation of the Boxed Processor.................................................................. 97
8-2 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes .......... 98
8-3 Assembly Stack Including the Support and Retention Module ................................................... 99
8-4 Boxed Processor Fan Heatsink Power Cable Connector ......................................................... 100
8-5 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 101
8-6 Boxed Processor TMA Set Points ............................................................................................102
4-1 Landout Diagram (Top View – Left Side).................................................................................... 44
4-2 Landout Diagram (Top View – Right Side) ................................................................................. 45
5-1 Thermal Profile for the Pentium D Processor with PRB=1 ......................................................... 77
5-2 Thermal Profile for the Pentium D Processor with PRB=0 ......................................................... 78
5-3 Case Temperature (TC) Measurement Location ........................................................................ 79
6-1 Processor Low Power State Machine......................................................................................... 86
7-1 Mechanical Representation of the Boxed Processor.................................................................. 89
7-2 Side View Space Requirements for the Boxed Processor (Applies to all four side views) ......... 90
7-3 Top View Space Requirements for the Boxed Processor........................................................... 90
7-4 Overall View Space Requirements for the Boxed Processor ..................................................... 91
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 92
7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 93
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ........................ 94
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ........................ 94
7-9 Boxed Processor Fan Heatsink Set Points................................................................................. 95
8-1 Mechanical Representation of the Boxed Processor.................................................................. 97
8-2 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes .......... 98
8-3 Assembly Stack Including the Support and Retention Module ................................................... 99
8-4 Boxed Processor Fan Heatsink Power Cable Connector ......................................................... 100
8-5 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) 101
8-6 Boxed Processor TMA Set Points ............................................................................................102