Справочник Пользователя для Intel Pentium 4 641 HH80552PG0882M
Модели
HH80552PG0882M
10
Datasheet
Introduction
non-executable. If code attempts to run in non-executable memory the processor raises an error to
the operating system. This feature can prevent some classes of viruses or worms that exploit buffer
overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel
the operating system. This feature can prevent some classes of viruses or worms that exploit buffer
overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel
®
Architecture Software Developer's Manual for more detailed information.
Intel will enable support components for the processor including heatsink, heatsink retention
mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be
completed from the top of the baseboard and should not require any special tooling.
mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be
completed from the top of the baseboard and should not require any special tooling.
The processor includes an address bus powerdown capability that removes power from the address
and data pins when the FSB is not in use. This feature is always enabled on the processor.
and data pins when the FSB is not in use. This feature is always enabled on the processor.
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset
components). The FSB is a multiprocessing interface to processors, memory, and I/O.
components). The FSB is a multiprocessing interface to processors, memory, and I/O.
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
•
Pentium 4 processor on 90 nm process in the 775-land package — Processor in the FC-
LGA4 package with a 1-MB L2 cache.
LGA4 package with a 1-MB L2 cache.
•
Processor — For this document, the term processor is the generic form of the Pentium 4
processor in the 775-land package.
processor in the 775-land package.
•
Keep-out zone — The area on or near the processor that system design can not use.
•
Processor core — Processor core die with integrated L2 cache.
•
FC-LGA4 package — The Pentium 4 processor in the 775-land package is available in a Flip-
Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with
an integrated heat spreader (IHS).
Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate with
an integrated heat spreader (IHS).
•
LGA775 socket — The Pentium 4 processor in the 775-land package mates with the system
board through a surface mount, 775-land, LGA socket.
board through a surface mount, 775-land, LGA socket.
•
Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
•
Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
•
Storage conditions—Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have