Инструкции для Intel Pentium 4 641

Содержание

• Contents

  3
• Revision History

  7
• Intel® Pentium® 4 Processor Supporting Hyper-Threading Technology1

  8
• 1 Introduction

  9
  • 1.1 Terminology

    10
    • 1.1.1 Processor Packaging Terminology

      10
  • 1.2 References

    11
• 2 Electrical Specifications

  13
  • 2.1 FSB and GTLREF

    13
  • 2.2 Power and Ground Lands

    13
  • 2.3 Decoupling Guidelines

    13
    • 2.3.1 VCC Decoupling

      14
    • 2.3.2 FSB GTL+ Decoupling

      14
    • 2.3.3 FSB Clock (BCLK[1:0]) and Processor Clocking

      14
  • 2.4 Voltage Identification

    15
    • 2.4.1 Phase Lock Loop (PLL) Power and Filter

      17
  • 2.5 Reserved, Unused, FC and TESTHI Signals

    18
  • 2.6 FSB Signal Groups

    19
  • 2.7 GTL+ Asynchronous Signals

    20
  • 2.8 Test Access Port (TAP) Connection

    21
  • 2.9 FSB Frequency Select Signals (BSEL[2:0])

    21
  • 2.10 Absolute Maximum and Minimum Ratings

    22
  • 2.11 Processor DC Specifications

    22
  • 2.12 VCC Overshoot Specification

    29
    • 2.12.1 Die Voltage Validation

      30
  • 2.13 GTL+ FSB Specifications

    30
• 3 Package Mechanical Specifications

  33
  • 3.1 Package Mechanical Specifications

    33
    • 3.1.1 Package Mechanical Drawing

      33
    • 3.1.2 Processor Component Keep-Out Zones

      37
    • 3.1.3 Package Loading Specifications

      37
    • 3.1.4 Package Handling Guidelines

      37
    • 3.1.5 Package Insertion Specifications

      38
    • 3.1.6 Processor Mass Specification

      38
    • 3.1.7 Processor Materials

      38
    • 3.1.8 Processor Markings

      38
    • 3.1.9 Processor Land Coordinates

      39
• 4 Land Listing and Signal Descriptions

  41
  • 4.1 Processor Land Assignments

    41
  • 4.2 Alphabetical Signals Reference

    64
• 5 Thermal Specifications and Design Considerations

  73
  • 5.1 Processor Thermal Specifications

    73
    • 5.1.1 Thermal Specifications

      73
    • 5.1.2 Thermal Metrology

      77
  • 5.2 Processor Thermal Features

    77
    • 5.2.1 Thermal Monitor

      77
    • 5.2.2 Thermal Monitor 2

      78
    • 5.2.3 On-Demand Mode

      79
    • 5.2.4 PROCHOT# Signal

      79
    • 5.2.5 THERMTRIP# Signal

      80
    • 5.2.6 Tcontrol and Fan Speed Reduction

      80
    • 5.2.7 Thermal Diode

      81
• 6 Features

  83
  • 6.1 Power-On Configuration Options

    83
  • 6.2 Clock Control and Low Power States

    83
    • 6.2.1 Normal State

      83
    • 6.2.2 HALT and Enhanced HALT Powerdown States

      84
      • 6.2.2.1 HALT Powerdown State

        84
      • 6.2.2.2 Enhanced HALT Powerdown State

        84
    • 6.2.3 Stop-Grant State

      85
    • 6.2.4 Enhanced HALT Snoop or HALT Snoop State, Grant Snoop State

      86
      • 6.2.4.1 HALT Snoop State, Grant Snoop State

        86
      • 6.2.4.2 Enhanced HALT Snoop State

        86
• 7 Boxed Processor Specifications

  87
  • 7.1 Mechanical Specifications

    88
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      88
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      89
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      89
  • 7.2 Electrical Requirements

    89
    • 7.2.1 Fan Heatsink Power Supply

      89
  • 7.3 Thermal Specifications

    91
    • 7.3.1 Boxed Processor Cooling Requirements

      91
    • 7.3.2 Variable Speed Fan

      93