Справочник Пользователя для Intel Pentium 4 641 HH80552PG0882M

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The Pentium 4 processor in the 775-land package requires a thermal solution to maintain 
temperatures within operating limits as set forth in 

. Any attempt to operate the 

processor outside these operating limits may result in permanent damage to the processor and 
potentially other components within the system. As processor technology changes, thermal 
management becomes increasingly crucial when building computer systems. Maintaining the 
proper thermal environment is key to reliable, long-term system operation.

A complete thermal solution includes both component and system level thermal management 
features. Component level thermal solutions can include active or passive heatsinks attached to the 
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of 
system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Intel

 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines.

The boxed processor will ship with a component thermal solution. Refer to 

the boxed processor.

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the 
system/processor thermal solution should be designed such that the processor remains within the 
minimum and maximum case temperature (T

C

) specifications when operating at or below the 

Thermal Design Power (TDP) value listed per frequency in 

. Thermal solutions not 

designed to provide this level of thermal capability may affect the long-term reliability of the 
processor and system. For more details on thermal solution design, refer to the appropriate 
processor thermal design guidelines.

The Pentium 4 processor in the 775-land package introduces a new methodology for managing 
processor temperatures which is intended to support acoustic noise reduction through fan speed 
control. Selection of the appropriate fan speed will be based on the temperature reported by the 
processor’s thermal diode. If the diode temperature is greater than or equal to T

control

 then the 

processor case temperature must remain at or below the temperature as specified by the thermal 
profile. If the diode temperature is less than T

control

 then the case temperature is permitted to 

exceed the thermal profile, but the diode temperature must remain at or below Tcontrol. Systems 
that implement fan speed control must be designed to take these conditions into account. Systems 
that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile 
specifications.

To determine a processor's case temperature specification based on the thermal profile, it is 
necessary to accurately measure processor power dissipation.