Техническая Спецификация для Intel 4 530 NE80546PG0801M

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A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active 
state when driven to a low level. For example, when RESET# is low, a reset has been requested. 
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where 
the name does not imply an active state but describes part of a binary sequence (such as address or 
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a 
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

“FSB” refers to the interface between the processor and system core logic (i.e., the chipset 
components). The FSB is a multiprocessing interface to processors, memory, and I/O.

Commonly used terms are explained here for clarification:

•

 4 processor on 90 nm process — Processor in the FC-mPGA4 package 

with a 1-MB L2 cache.

•

Processor — For this document, the term processor is the generic form of the Pentium 4 
processor on 90 nm process.

•

Keep-out zone — The area on or near the processor that system design cannot use. 

•

®

 865G/865GV/865PE/865P chipset — Chipset that supports DDR memory technology 

for the Pentium 4 processor on 90 nm process.

•

®

 875P chipset — Chipset that supports DDR memory technology for the Pentium 4 

processor on 90 nm process 

•

Processor core — Processor core die with integrated L2 cache. 

•

FC-mPGA4 package — The Pentium 4 processor on 90 nm process is available in a Flip-
Chip Micro Pin Grid Array 4 package, consisting of a processor core mounted on a pinned 
substrate with an integrated heat spreader (IHS). This packaging technology employs a 
1.27 mm [0.05 in] pitch for the substrate pins.

•

mPGA478B socket — The Pentium 4 processor on 90 nm process mates with the system 
board through a surface mount, 478-pin, zero insertion force (ZIF) socket.

•

Integrated heat spreader (IHS) —A component of the processor package used to enhance 
the thermal performance of the package. Component thermal solutions interface with the 
processor at the IHS surface.

•

Retention mechanism (RM)—Since the mPGA478B socket does not include any mechanical 
features for heatsink attach, a retention mechanism is required. Component thermal solutions 
should attach to the processor via a retention mechanism that is independent of the socket.

•

Storage conditions — Refers to a non-operational state. The processor may be installed in a 
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. 
Under these conditions, processor pins should not be connected to any supply voltages, have 
any I/Os biased, or receive any clocks. Upon exposure to “free air”(i.e. unsealed packaging or 
a device removed from packaging material) the processor must handled in accordance with 
moisture sensitivity labeling (MSL) as indicated on the packaging material.

•

Functional operation — Refers to normal operating conditions in which all processor 
specifications, including DC, AC, FSB, signal quality, mechanical and thermal, are satisfied.