Инструкции для Intel 4 530

Содержание

• 1 Introduction

  9
  • 1.1 Terminology

    10
    • 1.1.1 Processor Packaging Terminology

      10
  • 1.2 References

    11
• 2 Electrical Specifications

  13
  • 2.1 Power and Ground Pins

    13
  • 2.2 Decoupling Guidelines

    13
    • 2.2.1 VCC Decoupling

      13
    • 2.2.2 FSB GTL+ Decoupling

      13
    • 2.2.3 FSB Clock (BCLK[1:0]) and Processor Clocking

      14
  • 2.3 Voltage Identification

    14
    • 2.3.1 Phase Lock Loop (PLL) Power and Filter

      16
  • 2.4 Reserved, Unused, and TESTHI Pins

    17
  • 2.5 FSB Signal Groups

    18
  • 2.6 Asynchronous GTL+ Signals

    19
  • 2.7 Test Access Port (TAP) Connection

    19
  • 2.8 FSB Frequency Select Signals (BSEL[1:0])

    20
  • 2.9 Absolute Maximum and Minimum Ratings

    21
  • 2.10 Processor DC Specifications

    21
  • 2.11 VCC Overshoot Specification

    29
    • 2.11.1 Die Voltage Validation

      30
• 3 Package Mechanical Specifications

  31
  • 3.1 Package Mechanical Specifications

    31
    • 3.1.1 Package Mechanical Drawing

      32
    • 3.1.2 Processor Component Keep-out Zones

      35
    • 3.1.3 Package Loading Specifications

      35
    • 3.1.4 Package Handling Guidelines

      35
    • 3.1.5 Package Insertion Specifications

      36
    • 3.1.6 Processor Mass Specification

      36
    • 3.1.7 Processor Materials

      36
    • 3.1.8 Processor Markings

      36
    • 3.1.9 Processor Pinout Coordinates

      37
• 4 Pin List and Signal Description

  39
  • 4.1 Processor Pin Assignments

    39
  • 4.2 Alphabetical Signals Reference

    54
• 5 Thermal Specifications and Design Considerations

  63
  • 5.1 Processor Thermal Specifications

    63
    • 5.1.1 Thermal Specifications

      63
    • 5.1.2 Thermal Metrology

      66
  • 5.2 Processor Thermal Features

    67
    • 5.2.1 Thermal Monitor

      67
    • 5.2.2 On-Demand Mode

      68
    • 5.2.3 PROCHOT# Signal Pin

      68
    • 5.2.4 THERMTRIP# Signal Pin

      69
    • 5.2.5 Tcontrol and Fan Speed Reduction

      69
    • 5.2.6 Thermal Diode

      69
• 6 Features

  71
  • 6.1 Power-On Configuration Options

    71
  • 6.2 Clock Control and Low Power States

    72
    • 6.2.1 Normal State-State 1

      72
    • 6.2.2 AutoHALT Powerdown State-State 2

      72
    • 6.2.3 Stop-Grant State-State 3

      73
    • 6.2.4 HALT/Grant Snoop State-State 4

      73
    • 6.2.5 Sleep State-State 5

      74
• 7 Boxed Processor Specifications

  75
  • 7.1 Mechanical Specifications

    76
    • 7.1.1 Boxed Processor Cooling Solution Dimensions

      76
    • 7.1.2 Boxed Processor Fan Heatsink Weight

      77
    • 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      78
  • 7.2 Electrical Requirements

    78
    • 7.2.1 Fan Heatsink Power Supply

      78
  • 7.3 Thermal Specifications

    79
    • 7.3.1 Boxed Processor Cooling Requirements

      79
    • 7.3.2 Variable Speed Fan

      81